• PCB & CCL SUS630T High-Hardness High-Precision Lamination Press Plate High Temperature Resistant, Corrosion Resistant Steel Plate for Circuit Board & Copper Clad Laminate Production
  • PCB & CCL SUS630T High-Hardness High-Precision Lamination Press Plate High Temperature Resistant, Corrosion Resistant Steel Plate for Circuit Board & Copper Clad Laminate Production
  • PCB & CCL SUS630T High-Hardness High-Precision Lamination Press Plate High Temperature Resistant, Corrosion Resistant Steel Plate for Circuit Board & Copper Clad Laminate Production
PCB & CCL SUS630T High-Hardness High-Precision Lamination Press Plate High Temperature Resistant, Corrosion Resistant Steel Plate for Circuit Board & Copper Clad Laminate Production

PCB & CCL SUS630T High-Hardness High-Precision Lamination Press Plate High Temperature Resistant, Corrosion Resistant Steel Plate for Circuit Board & Copper Clad Laminate Production

Thông tin chi tiết sản phẩm:

Nguồn gốc: Trung Quốc
Hàng hiệu: MK
Số mô hình: MKSP-S630T

Thanh toán:

Số lượng đặt hàng tối thiểu: 50 cái
Giá bán: negotiable
chi tiết đóng gói: Gói ván ép chắc chắn với vật liệu bảo vệ mềm thích hợp bên trong, thích hợp cho việc vận chuyển đườn
Thời gian giao hàng: 10-20 ngày làm việc
Điều khoản thanh toán: L/C, D/A, D/P, T/T, Western Union
Khả năng cung cấp: 10000 mét vuông mỗi tháng
Giá tốt nhất Tiếp xúc

Thông tin chi tiết

Nguyên liệu thô: Inox SUS630T nội địa chất lượng cao Độ dày tiêu chuẩn: 1,0-2,0mm
Chiều rộng tối đa: ≤1300mm Độ dài tối đa: 2410mm
Tên sản phẩm: Tấm ép cán PCB & CCL SUS630T Độ nhám bề mặt: Ra 0,15μm, Rz 1,5μm
Làm nổi bật:

SUS630T high-hardness lamination press plate

,

high-temperature resistant steel plate for PCB

,

corrosion resistant CCL production steel plate

Mô tả sản phẩm

PCB & CCL SUS630T High-Hardness High-Precision Lamination Press Plate
MKSP-S630T high-precision lamination press plate utilizes premium domestic SUS630T stainless steel materials, delivering stable and reliable lamination performance with superior cost competitiveness. This specialized lamination steel plate for PCB and CCL production features exceptional thermal performance, high hardness, and outstanding corrosion resistance.
Product Advantages
SUS630T High-Hardness Lamination Press Plate | High Precision, High Temperature Resistance, Energy-Saving & Cost-Effective Solution for PCB & CCL Lamination
Feature Specification & Benefits
Raw Material High-quality domestic SUS630T stainless steel with mature, stable material formula
Cost Performance Reliable industrial-grade lamination quality with highly competitive pricing
Thermal Performance Excellent thermal conductivity and stable thermal expansion coefficient for significant energy and cost savings
Material Performance High hardness up to 50HRC±2, excellent corrosion resistance and mechanical stability
Equipment Compatibility Universally compatible with all types of industrial lamination steel plate washing machines
Application Scenarios Professional high-precision press plate for PCB printed circuit board and CCL copper clad laminate lamination processes
Standard Sizes
PCB Lamination Press Plate (L × W, mm):
1500×1295, 1300×800, 1295×787, 1295×1613, 1295×1143, 1295×787, 1285×750, 1280×1120, 1280×1070, 1280×970, 1270×1118, 1270×1070, 1143×660, 673×571, 660×508, 24"×28"
CCL Lamination Press Plate (L × W, mm):
1910×1270, 2210×1270, 2220×1270
Detailed Performance Parameters
Performance Parameter Mass-Lam Plate (SUS630T) Pin-Lam Plate (SUS630T)
Thickness 1.0-2.0mm 1.0-2.0mm
Max Width ≤1300mm ≤1300mm
Max Length ≤2410mm ≤2410mm
Thickness Tolerance ±0.10mm ±0.10mm
Surface Roughness Ra≤0.15μm, Rz≤1.5μm Ra≤0.15μm, Rz≤1.5μm
Positioning Hole Tolerance -- ±0.10mm
Standard Bushing Slot Tolerance -- 0 ~ +0.10mm
Warpage Degree ≤3mm/M ≤3mm/M
Length & Width Tolerance ±1mm ±1mm
Yield Strength ≥1175 N/mm² ≥1175 N/mm²
Tensile Strength ≥1400 N/mm² ≥1400 N/mm²
Extensibility ≥5% ≥5%
Hardness 50HRC±2 50HRC±2
Max Working Temperature ≤400℃ ≤400℃
Parallelism ≤0.03mm ≤0.03mm
Diagonal Deviation 1-2mm 1-2mm
Thermal Conductivity (@300℃) ≥18W/MK ≥18W/MK
Average Thermal Expansion Coefficient 10~12 (10⁻⁶/℃) 10~12 (10⁻⁶/℃)
PCB Lamination Steel Plate - High precision manufacturing process
SUS630T Lamination Press Plate for circuit board production

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