 |
2.0mm PCB & CCL SUS301H Ultra-Thin Lamination Press Plate for PCB or CCL laminator
Thông tin chi tiết sản phẩm:
| Nguồn gốc: | Trung Quốc |
| Hàng hiệu: | MK |
| Số mô hình: | MKSP-S630T |
Thanh toán:
| Số lượng đặt hàng tối thiểu: | 50 cái |
|---|---|
| Giá bán: | negotiable |
| chi tiết đóng gói: | Gói ván ép chắc chắn với vật liệu bảo vệ mềm thích hợp bên trong, thích hợp cho việc vận chuyển đườn |
| Thời gian giao hàng: | 10-20 ngày làm việc |
| Điều khoản thanh toán: | L/C, D/A, D/P, T/T, Western Union |
| Khả năng cung cấp: | 10000 mét vuông mỗi tháng |
|
Thông tin chi tiết |
|||
| Nguyên liệu thô: | Thép không gỉ SUS301H nhập khẩu cao cấp | Độ dày tiêu chuẩn: | Thước đo tùy chỉnh siêu mỏng 0,5mm / 1,0mm / 1,2mm |
|---|---|---|---|
| Ứng dụng: | Tấm hỗ trợ cán chuyên nghiệp cho bảng mạch in PCB và tấm phủ đồng CCL | Kích thước tiêu chuẩn (L*W mm): | 1500*1295, 1300*800, 1295*787, 1295*1613, 1295*1143, 1285*750, 1280*1120mm, v.v. |
| Tên sản phẩm: | Tấm ép cán siêu mỏng PCB & CCL SUS301H | Dung sai kích thước L/W.: | ± 1mm |
| Làm nổi bật: | 2.0mm PCB lamination press plate,ultra-thin CCL SUS301H plate,PCB laminator press plate |
||
Mô tả sản phẩm
Product Overview
MKSP-S301 ultra-thin lamination press plate is manufactured with high-quality imported German and Japanese SUS301H stainless steel materials. Featuring ultra-thin design and stable, reliable lamination performance, this cost-effective solution is optimized for PCB and CCL mass production lamination processes.
The ultra-thin structural design enables more stacking layers during each lamination cycle, significantly boosting production throughput. It reduces interlayer temperature differences inside the laminator, stabilizes board thermal expansion and contraction, and eliminates copper plate wrinkling defects caused by uneven heat conduction.
Universally compatible with all mainstream lamination steel plate washing machines, this product delivers high adaptability for diverse production scenarios.
Standard Sizes
PCB Lamination Press Plate (L × W, mm)
1500×1295, 1300×800, 1295×787, 1295×1613, 1295×1143, 1295×787, 1285×750, 1280×1120, 1280×1070, 1280×970, 1270×1118, 1270×1070, 1143×660, 673×571, 660×508, 24"×28"
CCL Lamination Press Plate (L × W, mm)
1910×1270, 2210×1270, 2220×1270
Premium SUS301H Ultra-Thin Press Plate | High Productivity, Stable Lamination, Anti-Wrinkle Solution for PCB & CCL Manufacturing
Core Product Advantages
- Raw Material: Premium imported SUS301H stainless steel (German/Japanese raw material) with high rigidity and durability
- Standard Thickness: 0.5mm / 1.0mm / 1.2mm ultra-thin customized gauge
- Production Optimization: Supports more lamination stacking layers to effectively improve production capacity; reduces interlayer temperature difference to stabilize board size tolerance
- Thermal Performance: Excellent thermal conductivity and stable thermal expansion coefficient, completely solving copper plate wrinkling problems
- Equipment Compatibility: Fully adaptable to all types of industrial lamination steel plate washing machines
- Application Scenarios: Professional lamination supporting plate for PCB printed circuit boards and CCL copper clad laminates
- Cost Performance: Reliable industrial-grade quality with competitive pricing and lower comprehensive production cost
Performance Parameters
| Parameter | SUS630T Mass-Lam Plate | SUS630T Pin-lam Plate |
|---|---|---|
| Thickness | 1.0-2.0mm | 1.0-2.0mm |
| Width | ≤1300 | ≤1300 |
| Length | ≤2410 | ≤2410 |
| Thickness tolerance | ±0.10 | ±0.10 |
| Surface roughness (um) | Ra≤0.15 Rz≤1.5 | Ra≤0.15 Rz≤1.5 |
| Positioning hole to hole tolerance | -- | +/-0.10 |
| Standard bushing slot tolerance | -- | +0.10/-0mm |
| Warpage degree | ≤3mm/M | ≤3mm/M |
| L/W size tolerance | ±1mm | ±1mm |
| Yield strength | ≥1175 N/mm² | ≥1175 N/mm² |
| Tensile strength | ≥1400 N/mm² | ≥1400 N/mm² |
| Extensibility | ≥5% | ≥5% |
| Hardness HRC | 50HRC±2 | 50HRC±2 |
| Work temperature | ≤400℃ | ≤400℃ |
| Parallelism | ≤0.03 | ≤0.03 |
| Diagonal deviation | 1-2mm | 1-2mm |
| Thermal conductivity | ≥18W/MK at 300℃ | ≥18W/MK at 300℃ |
| Average thermal expansion coefficient (10⁻⁶/℃) | 10~12 | 10~12 |
Muốn biết thêm chi tiết về sản phẩm này